Specifically designed for
Nanoscribe IP Resins are established standard materials for high-resolution microfabrication. Submicrometer resolution and shape accuracy as well as easy handling are key features of these negative-tone resins.
Choose the photoresins best suited to your applications and benefit from submicron features, overhanging elements, optical-quality surfaces, or high-speed mesoscale fabrication up to the macroscale.
As printing materials, IP Resins are essential elements of Nanoscribe’s Microfabrication Solution Sets. The printer software offers advanced recipes optimized for different photoresins and applications. They make the 3D printing workflow straightforward and speed up the design iteration cycles for multiple scientific and industrial uses ranging from biomimetic surfaces, microoptical elements to mechanical metamaterials and micromachines.
We provide a product line of negative-tone resins, called IP Photoresins. They are optimized for Two-Photon Polymerization (2PP) and feature remarkable properties required in high-precision additive manufacturing:
- Minimum feature sizes of typ. 160 nm
- High-speed microfabrication
- Excellent adhesion to various substrates
- Optimized mechanical stability and excellent shape accuracy
- Straightforward handling and easy processing
- Neither spin-coating nor post-exposure bake required
Our photoresins are optimized for its use with Nanoscribe Photonic Professional GT2 3D printer and Quantum X maskless lithography system.
Wide range of materials
The microfabrication systems from Nanoscribe are designed as open systems, suitable for a broad selection of materials. The variety of materials extends further to commercial UV-curable photoresists, hydrogels, nanoparticle composite resins, and custom-made materials.
To satisfy the needs of material developers for testing new resins, a variety of materials and processes allow optical, mechanical, electrical, chemical and biological properties to be tuned as needed, e.g., in optics, photonics or biomedical engineering.
Post-print processes, e.g., casting, atomic layer deposition (ALD), chemical vapor deposition (CVD) or galvanization, allow modification of the 3D printed structures and permit the inclusion of further materials including other plastics, ceramics, metals, or glass.
Explore details on
materials and processes
|IP-Q||High-speed fabrication of up to 100 mm³ print volumes. Designed for Dip-in Laser Lithography (DiLL)||Biomedical engineering, mechanical components, micro rapid prototyping.|
|IP-S||Smooth surfaces for micro- and mesoscale fabrication with optical-quality surface roughness and shape accuracy. Designed for DiLL.||Mechanical metamaterials, micro-optics, integrated photonics, microfluidics, cell scaffolds.|
|IP-Dip||Submicron features and high aspect ratios. Designed for DiLL.||Photonic metamaterials, diffractive optical elements, microrobots.|
|IP-G 780||Complex 3D designs, e.g., overhanging elements. Submicron features and low shrinkage. Designed for oil immersion configuration.||Overhanging elements in biomimetics, photonics, microrobots.|
|IP-L 780||Submicron features and low shrinkage. Designed for oil immersion configuration. Compatible with DiLL.||Plasmonics, photonic and biomimetic surfaces.|
Commercial photoresists from other vendors
- SU-8 – negative-tone, epoxy-based resists
- AZ ® photoresists – positive-tone resists
- ORMOCER ® polymers – inorganic-organic hybrid polymers
- Hydrogels - e.g., degradable resins
- Composite materials
- Liquid-crystal elastomers
- Atomic layer deposition (ALD)
- Chemical vapor deposition (CVD)
- Physical vapor deposition (PVD)
- Electroless plating
- Casting in PDMS
- Nanoimprint lithography
- Hot embossing
- Injection molding